Advanced Packaging Internship

This program offers a unique internship opportunity specifically designed for students enrolled in the Advanced Packaging Flagship Curriculum. You’ll gain practical experience in Intel’s cutting-edge facilities, applying the knowledge you’ve acquired in the program to real-world scenarios within the field of advanced packaging technologies.

Qualifications

• Currently enrolled in a program participating in the Advanced Packaging Flagship Curriculum.
• Completion of coursework related to advanced packaging technologies.
• Eagerness to learn and apply knowledge in a fast-paced environment
• Ability to follow safety protocols and work effectively in a team setting

Responsibilities

• Responsibilities and project assignments will vary depending on the specific function or department you’re assigned to.
• The internship focuses on providing practical exposure to advanced packaging processes and their role within the semiconductor manufacturing ecosystem.
• Tasks may involve assisting engineers with projects, participating in data collection and analysis, and contributing to process improvement initiatives.

Benefits

• Gain valuable hands-on experience in advanced packaging, a critical technology in the semiconductor industry
• Apply classroom knowledge to real-world applications under the guidance of experienced professionals
• Develop practical skills and enhance your understanding of the advanced packaging landscape
• Strengthen your resume and gain a competitive edge for future career opportunities in the field

Location

• Kulim, Kedah, Malaysia

Deadline: Unspecified.

Apply Now