This program offers a unique internship opportunity specifically designed for students enrolled in the Advanced Packaging Flagship Curriculum. You’ll gain practical experience in Intel’s cutting-edge facilities, applying the knowledge you’ve acquired in the program to real-world scenarios within the field of advanced packaging technologies.
Qualifications
- Currently enrolled in a program participating in the Advanced Packaging Flagship Curriculum.
- Completion of coursework related to advanced packaging technologies.
- Eagerness to learn and apply knowledge in a fast-paced environment
- Ability to follow safety protocols and work effectively in a team setting
Responsibilities
- Responsibilities and project assignments will vary depending on the specific function or department you’re assigned to.
- The internship focuses on providing practical exposure to advanced packaging processes and their role within the semiconductor manufacturing ecosystem.
- Tasks may involve assisting engineers with projects, participating in data collection and analysis, and contributing to process improvement initiatives.
Benefits
- Gain valuable hands-on experience in advanced packaging, a critical technology in the semiconductor industry
- Apply classroom knowledge to real-world applications under the guidance of experienced professionals
- Develop practical skills and enhance your understanding of the advanced packaging landscape
- Strengthen your resume and gain a competitive edge for future career opportunities in the field
Location
- Kulim, Kedah, Malaysia
Deadline: Unspecified.