Summary
Unleash your passion for innovation at HP! This Printing Systems Engineering Internship offers a dynamic opportunity for engineering students to gain hands-on experience in the world of cutting-edge printing technology. You’ll collaborate with experienced engineers, contribute to the development and testing of next-generation printing systems, and help shape the future of HP’s printing solutions.
Qualifications
- Currently enrolled in an accredited undergraduate or graduate program in Computer Science or Telecommunications fields or a related field.
- A strong foundation in engineering principles and a passion for technology innovation.
- Proficiency in engineering design software (e.g., SolidWorks, AutoCAD) and analytical tools (a plus).
- Experience with 3D printing or additive manufacturing (a plus).
- Strong problem-solving skills and a detail-oriented approach.
- Excellent communication and collaboration skills, with the ability to work effectively in a team environment.
Responsibilities
- Assist with the design, development, and testing of new printing system components and prototypes.
- Conduct research and analyze data to support printing system performance optimization.
- Participate in troubleshooting technical challenges and identifying improvement opportunities.
- Gain exposure to various printing technologies and production processes.
- Contribute to technical documentation and project reports.
- Support engineering teams with presentations and technical discussions.
Benefits
- Gain valuable experience in the exciting field of printing systems engineering at a leading technology company.
- Develop and enhance your engineering skills, problem-solving abilities, and technical knowledge.
- Learn from industry professionals and gain insights into the development process for printing systems.
- Network with engineers and explore potential career paths in printing technology.
- Contribute to the innovation of printing solutions that shape the future of HP’s business.
Location
Barcelona, Cataluña, Spain
Deadline: Unspecified (Availability to start early November 2023)