Physical Design Engineer Intern

Are you passionate about chip design and the inner workings of cutting-edge technology? This internship at Intel offers a hands-on introduction to the world of Physical Design Engineering. You’ll collaborate with experienced professionals, gain practical experience in the physical design flow, and contribute to the development of future Intel products.

Qualifications

• Pursuing a Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• Strong coursework in VLSI design (Very-Large-Scale Integration) is essential.
• Experience with Electronic Design Automation (EDA) tools is a plus (e.g., Cadence Virtuoso, Synopsys ICC).
• Proficiency in programming languages commonly used in chip design (e.g., Verilog, Python) is beneficial.
• Excellent analytical and problem-solving skills with meticulous attention to detail.
• Strong communication and teamwork abilities to collaborate effectively within a team environment.

Responsibilities

• Participate in various stages of the physical design flow, including placement, clock tree synthesis, routing, and power planning.
• Assist with design for manufacturability (DFM) techniques to ensure efficient chip production.
• Utilize computer-aided design (CAD) tools to perform physical layout and verification tasks.
• Collaborate with design and logic engineers to optimize chip performance and functionality.
• Gain exposure to timing closure techniques and power integrity analysis.

Benefits

This internship provides a unique opportunity to acquire practical skills in physical design engineering at a leading semiconductor company. You’ll work alongside industry experts, learn from real-world projects, and contribute to the creation of next-generation technologies.

Location

Phoenix, Arizona, United States

Deadline: Unspecified.

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