Launch your career in the dynamic world of semiconductor manufacturing with this PGDM Die Aggregation Engineering internship at Intel! Based in Penang, Malaysia, you’ll gain valuable hands-on experience supporting the assembly and testing processes of Intel’s cutting-edge technology. You’ll collaborate with experienced professionals, contribute to maintaining world-class quality standards, and play a vital role in bringing Intel products to life.
Qualifications
- Currently pursuing a Post Graduate Diploma in Management (PGDM) with a specialization in Engineering Management, Manufacturing Engineering, or a closely related field.
- Prior experience in a manufacturing environment or a strong understanding of production processes is a plus.
- Familiarity with quality control principles and procedures is beneficial.
- Strong analytical and problem-solving skills with a keen eye for detail.
- Excellent communication and interpersonal skills to collaborate effectively within a team environment.
- Ability to work independently and take initiative in assigned tasks.
Responsibilities
- Assist with the setup, installation, and qualification of module tools and equipment used in the die aggregation process.
- Analyze data and identify potential issues to ensure smooth production flow and high-quality output.
- Participate in process improvement initiatives, suggesting and implementing strategies to optimize efficiency and yield.
- Support the development and maintenance of technical documentation related to die aggregation processes.
- Work closely with quality control engineers to ensure adherence to rigorous quality standards and specifications.
Benefits
This internship provides a unique opportunity to acquire practical skills in die aggregation engineering at a leading semiconductor manufacturer. You’ll work alongside industry experts, contribute to Intel’s commitment to excellence, and gain valuable experience in a fast-paced and technologically advanced environment.
Location
Penang, Malaysia
Deadline: Unspecified.